Description

This package is dedicated to branch circuits inside distribution boards or intermediate junction boxes where abnormal temperature rise is detected—either by touch or by thermal imaging showing a distinct gradient. We use both contact thermocouples and infrared thermal imaging to take temperature readings across the input/output terminals, copper busbar contact faces, conductor crimp terminals, and protective device terminal screws, creating a temperature rise table referenced to ambient temperature. Measurements are timed to coincide with typical load periods to ensure captured data reflects real heat generation under actual operating conditions.

After confirming the overheating node, we analyze the root cause—distinguishing between loose terminal crimping causing contact resistance heating, undersized conductors leading to ohmic heating, or multiple conductors sharing one terminal causing unbalanced current distribution. Different countermeasures include re-tightening with a torque wrench to standard values, replacing the conductor segment with a larger cross-section, or adding an auxiliary terminal block to split the current path. After treatment, we repeat the on-load temperature measurement to confirm temperature reduction as proof of effectiveness.

This service’s intervention scope and intensity are uniquely tailored based on on-site temperature data, load current magnitude, and terminal connection methods. A deposit is required for the thermal imaging equipment deployment and initial temperature data collection, with the amount estimated based on the number of branch circuits to be investigated and their panel distribution. After all overheating points are eliminated and re-verified, the final balance is calculated according to the number of tightening operations, replaced components, and total work hours.